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2043MK5

Reflow Oven

Key Features

  • Nitrogen/air lead-free reflow soldering system
  • Enhanced heating module and fastest cooling ramp
  • Save energy and nitrogen
  • Simple maintenance design
  • Temperature curve in one step
  • Built-in ECD-CPK process monitoring tool
  • Optional dual-track design to maximize production capacity

Specifications

Number of heating zones

Top:13/ Bottom:13

Number of cooling zones

Above: 3

substrate width

 

 

50-610mm

maximum transfer speed

188cm/min

Lateral temperature difference

+2°C

Temperature control accuracy

‡ 0.1°C

Track adjustment method

Motor driven, manual control

operating system

Windows 7

Equipment size

W6500 ×D1370 ×H1600 mm

equipment weight

About 3400kg

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