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New type electronic equipment being evolved continuously. The SMT supporting such evolution is required to advance in precision, efficiency and integration. YAMAHA copes with further progress by offering series of "Next generation intelligent modular: YS series" which has been newly developed and provides "JUST FIT SOLUTION" which has achieved satisfactory results and enjoyed the confidence of users.

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YRi-V

3D Hybrid Optical Inspection System

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MSL

Achieve stable spraying of ultra-micro solder paste

- Top position repeatability +/-5um (3 Sigma)

- High-speed visual processing 0.03 sec/chip.

- The measurement repeatability of the visual system is ±1μm

- Dispensing speed 2000 times/sec

- Ultra-micro dispensing of solder paste 110μm

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YSi-V

Inspection Method: 2D+3D+4-way angular camera (option)+laser

Resolution (options) : 12μm or 7μm

Purpose: Mounted Substrate inspection (AOI)

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YCP10

Cycle time※ : 13.5sec

Positioning repeatability(6σ) : ±0.01mm

Print head: 3S print head/W scraper head

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YSM20WR

Applicable PCB : 81,000CPH

Printing accuracy(3σ) : ±0.035mm(±0.025mm)※

Mountable components : 0201mm-W55xL100 T28mm

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YSM20R(PV)

Applicable PCB : 95,000CPH

Printing accuracy(3σ) : ±0.035mm(±0.025mm)※

Mountable components : 0201mm-W55xL100 T28mm

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YSD

Dispensing tack : 0.07sec/shot

Dispensing accuracy (μ+3σ) : ±0.05mm

Dispensing tack: Pneumatic pulse type

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YSP20

Cycle time※ : 5sec

Positioning repeatability(6σ) : ±0.01mm

Print head: 3S print head

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YC8

Applicable PCB : 1,440CPH

Printing accuracy(3σ) : ±0.03mm

Mountable components : 4mm-100 T45mm

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S10

Applicable PCB : 45,000CPH

Printing accuracy(μ+3σ) : ±0.025mm

Mountable components : 0201mm-W90xL120 T30mm

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