MKV-VR
Online vacuum reflow oven
Key Features
- Improve the heat loss or welding structure of components (reduce the increase in current density caused by voids)
- Reduce the effects of heat loss, vibration and impact on solder joints and improve long-term stability and reliability
- Improve the performance of components under high frequency use
- Maintain component impedance within specifications (such as power modules)
- Reduce or eliminate poor soldering (such as occurring in uBGA bridging)
Specifications
Number of heating zones | Above: 8 / Below: 8 |
Number of cooling zones | Above: 2 |
substrate width | 50 ~ 610 mm |
maximum transfer speed | 188cm/min |
Lateral temperature difference | ±2℃ |
Temperature control accuracy | ±0.1℃ |
Furnace cavity working gas | Nitrogen |
Minimum vacuum degree | <10 pallet (option: 1 pallet) |
Transmission track adjustment method | Motor driven, manual control |
operating system | Windows 7 |
Equipment size | W4650xD1370xH1600 mm |
Equipment weight | Approximately 2,060 kg |