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MKV-VR

Online vacuum reflow oven

Key Features

  • Improve the heat loss or welding structure of components (reduce the increase in current density caused by voids)
  • Reduce the effects of heat loss, vibration and impact on solder joints and improve long-term stability and reliability
  • Improve the performance of components under high frequency use
  • Maintain component impedance within specifications (such as power modules)
  • Reduce or eliminate poor soldering (such as occurring in uBGA bridging)

Specifications

Number of heating zones

Above: 8 / Below: 8

Number of cooling zones

Above: 2

substrate width

50 ~ 610 mm

maximum transfer speed

188cm/min

Lateral temperature difference

±2℃

Temperature control accuracy

±0.1℃

Furnace cavity working gas

Nitrogen

Minimum vacuum degree

<10 pallet (option: 1 pallet)

Transmission track adjustment method

Motor driven, manual control

operating system

Windows 7

Equipment size

W4650xD1370xH1600 mm

Equipment weight

Approximately 2,060 kg

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