Tagliner Inlay Die Bonder

ADAT3 XF Tagliner is three times faster and 30% more accurate than anything on the market. Common systems only work with transparent web material; this Tagliner handles a diverse range, including paper enabling you to move away from PET plastics for sustainability. Eliminating manual handling through automated wafer change and qualified for die bond of all known ICs down to 200 μm die size, the ADAT3 XF Tagliner performs a complete inspection without sacrificing speed and productivity