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Surface Mount Technology

Inline Vacuum Reflow Oven

  • Product Name: Inline Voidless / Vacuum Reflow Oven
  • Product Model: 1800/1900 Series Oven
  • Product Brand: Heller

      The Voidless / Vacuum Reflow Soldering Oven is Heller’s new generation of high quality reflow system. Existing voids escape externally through the solder when vacuum is applied. Trapped gas bubbles increase in size as pressure is reduced. Larger bubbles are more likely to collide with other bubbles and ultimately collide with the edge of liquid solder to escape. Vacuum-assisted reflow has been shown to reduce the voids in a solder joint by 99%。

Key Features:

  • heat dissipation of components or solder joint structures (i.e., current density increases with voiding)
  • Improve long-term stability and reliability of solder joint against heat dissipation and vibration/shock
  • Improve chip performance in high frequency applications
  • Maintain impedances within spec for components (i.e. power modules)
  • Mitigate or eliminate solder problems (bridging, solder splashes, i.e. at μBGAs)

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