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Surface Mount Technology

ATHENA Inline Color 3D AOI

  • Product Name: 3D Automated Optical Inspection System
  • Product Model: ATHENA Series
  • Product Brand: Pemtron
  • http://www.pemtron.com

Key Features

  • 8+4 Way Projection + 3-Stage 2D Lighting
  • 2D and 3D Simultaneous Inspection Algorithms
  • Telecentric Lens Provide Higher Accuracy and Detection
  • High Speed GPU and Image Processing
  • User Friendly Graphical Interface
  • Built-in Libraries Management System
  • Offline Real Time Debug System(Option)

Advanced High Speed Inspection and Measurement Technology

1、Shadowless Phase Measuring Profilometry

  • ATHENA Series 10MP 8+4 Projector 3D AOI inspects 100% of the PCB in 2D and 3D. Combining the 2 technologies gives a complete optical inspection of a PCB shadow free and low false calls maintaining a high flexibility in system functionality.

2High Speed Inspection Technology

  • ATHENA High Speed Option inspects in 41cm sq. per sec. by utilizing an advanced network of more powerful GPU, controller boards and our proprietary developed 10MP 15um 180fps camera with telecentric lens.

3High Component Inspection Technology

  • ATHENA new 8+4 Way option Projection Technology provides 100% 3D inspection of 27mm component and this is the first in the AOI field. With optional Z axis, the maximum component height in 3D inspection is up to 60mm.

4、Shado w Free 3D Technology

  • Eliminates shadow issues on highly populated PCBs and tall components.

5Optical Character Recognition

  • Recognizes component part characters by using color and pattern algorithms. Ability to add & modify OCR font to optimize inspection condition.

63D Solder & Height Measurement

  • Using our advanced 3D technology, the ATHENA is able to take inspection to levels that are limited by conventional 2D systems. Adding solder height, volume and part coplanarity inspection provides enhanced defect detection capabilities.

73D Lead Inspection

  • 3D measurement algorithms enable the ATHENA to measure lead height and volume of solder proving full-high quality 3D images.

82D RGB Algorithms

  • Through the RGB distinguish, operator can easily confirm the failures such as cold joint and lift lead.

An accurate and convenient Inspection by using Side Camera

Four high-definition cameras on the side and a dedicated algorithm optimized for both use and side inspection is available for real-time inspection.

  • 4-Way Side Camera (Option)
  • Possible to detect inside bridge which it cannot detect with Top camera
  • Possible to detect Connector inside area
  • Convenient Teaching by using existing Algorithm.

Ease of programming (Auto Teach Function)

  • Advanced 3D imaging technology allows us to measure and recognize the geometric shapes of PCB components and automatically link them to our built in parts library.

Real Time Process Management & Quality Management Solutions

Specifications

Machine Model ATHENA ATHENA L ATHENA D ATHENA DL
Vision Algorithm 2D: Vision Inspection Algorithm   3D: PMP Algorithm (Moire Tecnology)
Camera 10 MP、12 MP
X/Y Pixel Resolution 10um、15um、18um
Max. PCB Size 330*330mm 510*510mm

DL:330*280mm SL:330*500mm

DL:510*330mm SL:510*600mm

Min. PCB Size 50 *50 mm
PCB Thickness 0.4 – 7 mm
PCB Clearance Top:50mm Bottom:50 mm
Height Range 0-5.5m (Option 27mm、Z Axis)
Max. PCB Warpage ±3mm
Motor Type X/Y Linear Servo Motor
Power Requirement 220-240Vac,Single Phase, 50/60 Hz
Remark ATHENA supports special board size requirement(Max. Board length is 1.2m)

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