Inline Vacuum Reflow Soldering
The Voidless / Vacuum Reflow Soldering Oven is Heller’s new generation of high quality reflow system. Existing voids escape externally through the solder when vacuum is applied. Trapped gas bubbles increase in size as pressure is reduced. Larger bubbles are more likely to collide with other bubbles and ultimately collide with the edge of liquid solder to escape. Vacuum-assisted reflow has been shown to reduce the voids in a solder joint by 99%.